FH-760 copper-tin plating additive
FH-760 Copper-Tin Plating Additive: Technical Overview The FH-760 is a high-performance additive designed for electroplating copper-tin (Cu-Sn) alloys, particularly for applications requiring uniform deposition, excellent corrosion resistance, and enhanced solderability. This additive is widely used in electronics, automotive components, and decorative finishes due to its ability to produce dense, low-porosity coatings with superior adhesion. Key Features 1. Stable Bath Performance The FH-760 additive ensures long-term bath stability by minimizing decomposition and maintaining consistent plating quality over extended periods. It reduces the risk of impurities and sludge formation, lowering maintenance costs. 2. Uniform Deposition It promotes even metal distribution across complex geometries, ensuring consistent thickness on edges, recesses, and high-current-density areas. This is critical for components like connectors or printed circuit boards (PCBs). 3. Controlled Alloy Composition The additive enables precise adjustment of the copper-tin ratio (typically 60-90% Cu, 10-40% Sn), allowing customization for specific mechanical or electrical properties. Higher tin content improves solderability, while higher copper enhances conductivity. 4. Bright and Smooth Finish FH-760 produces a semi-bright to bright surface, reducing the need for post-plating polishing. The coating exhibits low internal stress, minimizing cracking or peeling. 5. Environmental and Operational Benefits - Operates at moderate temperatures (20–40°C), reducing energy consumption. - Compatible with cyanide-free or low-cyanide baths, aligning with environmental regulations. - Low foaming characteristics ensure easy filtration and waste treatment. Applications - Electronics: PCB contacts, connectors, and semiconductor packaging. - Automotive: Bearings, bushings, and corrosion-resistant fittings. - Decorative Finishes: Hardware and consumer goods requiring an antique bronze or nickel-like appearance. Operating Parameters - Current Density: 1–5 A/dm² (adjustable for high/low-speed plating). - pH Range: 8–12 (alkaline bath). - Agitation: Mild mechanical or air agitation recommended. Advantages Over Traditional Plating Compared to standalone copper or tin plating, FH-760’s alloy coating offers better wear resistance, reduced porosity, and improved thermal stability. Its self-leveling properties minimize defects like pitting or burning. Conclusion The FH-760 copper-tin plating additive is a versatile solution for industries demanding high-quality, durable alloy coatings. Its balance of operational efficiency, environmental compliance, and exceptional finish makes it a preferred choice for advanced electroplating applications.
Products
Category:
-
FH-760 hanging plating lead-free and nickel-free white copper tin
Category： Environmentally friendly nickel-free black nickel gun black processBrowse number： 432Number：Release time： 2025-09-10 08:59:42The FH-760 Lead-Free Nickel-Free White Copper-Tin Plating Process is a new-generation electroplating additive solution developed by Shenzhen Xinfuhua Surface Technology Co., Ltd. It is specially designed to replace conventional nickel-based plating processes, providing an eco-friendly, lead-free, and nickel-free solution for white copper-tin plating.
News
Category:
No search results found！
Case
Category:
No search results found！
Video
Category:
No search results found！
Download
Category:
No search results found！
Job
Category:
No search results found！
Featured Products
-
NEWS
FH-760 hanging plating lead-free and nickel-free white copper tin
Learn more
Phone